SAE AMS3373 Compound, Silicone Rubber, Insulating and Sealing 35 to 55
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Product Code:SAE AMS3373
Title:Compound, Silicone Rubber, Insulating and Sealing 35 to 55
Issuing Committee:Ams G9 Aerospace Sealing Committee
Scope: This specification covers elastomeric silicone insulating and sealing compounds supplied as two-component systems which cure at room temperature.These products have been used typically for protecting the electrical integrity of electrical and electronic components by excluding moisture and contamination and by providing resilient cushioning between -50 and +205 degrees C (-58 and +401 degrees F), but usage is not limited to such applications. Compound may be applied by potting or encapsulating.
Rationale: This specification covers elastomeric silicone insulating and sealing compounds supplied as two-component systems which cure at room temperature.These products have been used typically for protecting the electrical integrity of electrical and electronic components by excluding moisture and contamination and by providing resilient cushioning between -50 and +205 degrees C (-58 and +401 degrees F), but usage is not limited to such applications. Compound may be applied by potting or encapsulating.
Title:Compound, Silicone Rubber, Insulating and Sealing 35 to 55
Issuing Committee:Ams G9 Aerospace Sealing Committee
Scope: This specification covers elastomeric silicone insulating and sealing compounds supplied as two-component systems which cure at room temperature.These products have been used typically for protecting the electrical integrity of electrical and electronic components by excluding moisture and contamination and by providing resilient cushioning between -50 and +205 degrees C (-58 and +401 degrees F), but usage is not limited to such applications. Compound may be applied by potting or encapsulating.
Rationale: This specification covers elastomeric silicone insulating and sealing compounds supplied as two-component systems which cure at room temperature.These products have been used typically for protecting the electrical integrity of electrical and electronic components by excluding moisture and contamination and by providing resilient cushioning between -50 and +205 degrees C (-58 and +401 degrees F), but usage is not limited to such applications. Compound may be applied by potting or encapsulating.
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